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查詢企業職位薪資
英業達股份有限公司薪資資訊分析
近年來,隨著科技產業的蓬勃發展,對於具備專業技能的人才需求日益增加。本文針對英業達股份有限公司(股票代號:2356)的薪資狀況進行分析,提供求職者參考。由於資料來自多位使用者提供的薪資紀錄,且涵蓋不同職位與時間區間,因此本分析僅呈現大致趨勢,不代表單一職缺的具體薪酬水平。
從現有資料顯示,英業達在多個技術領域的工程師需求較高,包含散熱設計、半導體製程、系統整合測試等。這些職位的月薪普遍落在新台幣3萬至5萬元之間。例如,散熱設計工程師與系統整合測試工程師的薪資約在4萬5千元左右;而半導體製程人員則約為3萬元。此外,軟體工程師、韌體工程師等職位也佔有一定比例,其薪資水平同樣在數萬元區間。
值得注意的是,英業達對於具備特定技能的人才給予較高的薪酬。例如,專案經理(PM)與資深工程師的薪資可達新台幣6萬至8萬元以上。此外,部分職位如硬體研發、電源工程師等,也因技術門檻較高而擁有較具競爭力的薪資待遇。
然而,資料也顯示不同職位之間的薪資差距相當大。從測試工程師到網路工程師,月薪範圍從新台幣4萬元到5萬元不等。這反映出英業達對於不同技能與經驗的要求有所差異,進而影響了薪酬水平。
整體而言,英業達的薪資結構呈現多元化趨勢,反映了公司在不同領域的發展策略與人才需求。求職者在參考本分析時,應結合自身專業技能、工作經驗與職位內容,以更準確地評估自身在英業達的潛在薪資水平。此外,由於資料主要來自使用者提供的資訊,可能存在個別差異,建議求職者多方蒐集資訊並謹慎判斷。
Salary Information Analysis of Yingye Da Co., Ltd.
In recent years, with the booming development of the technology industry, the demand for talent with professional skills has been increasing. This article analyzes the salary situation at Yingye Da Co., Ltd. (Stock Code: 2356) to provide reference for job seekers. Since the data comes from salary records provided by multiple users and covers different positions and time periods, this analysis only presents general trends and does not represent the specific compensation level for any single position.
Based on the available data, Yingye Da has a high demand for engineers in various technical fields, including heat dissipation design, semiconductor process, and system integration testing. The monthly salaries for these positions generally fall between NT$30,000 and NT$50,000. For example, the salaries for heat dissipation design engineers and system integration testing engineers are approximately NT$45,000; while semiconductor process personnel are around NT$30,000. Furthermore, positions such as software engineers and firmware engineers also constitute a certain proportion, with their salary levels also in the tens of thousands of dollars.
It is noteworthy that Yingye Da offers higher compensation to talent possessing specific skills. For instance, salaries for Project Managers (PMs) and senior engineers can reach NT$60,000 to NT$80,000 or more. Additionally, some positions such as hardware R&D and power engineers have more competitive compensation due to higher technical barriers.
However, the data also shows significant salary gaps between different positions. From test engineers to network engineers, the monthly salary range varies from NT$40,000 to NT$50,000. This reflects differences in Yingye Da's requirements for various skills and experience, which subsequently affects the compensation level.
Overall, Yingye Da's salary structure shows a diversified trend, reflecting the company's development strategy and talent needs in different areas. When referencing this analysis, job seekers should combine their professional skills, work experience, and job content to more accurately assess their potential salary level at Yingye Da. Furthermore, since the data primarily comes from user-provided information, individual differences may exist; it is recommended that job seekers gather information from multiple sources and make careful judgments.
| # | 職位名稱 | 起迄時間 | 月薪 |
|---|
| 1 |
EE |
2026-01 ~ 2026-02 |
|
| 2 |
EC |
2026-01 ~ 2026-02 |
|
| 3 |
韌體開發 |
2025-12 ~ 2026-01 |
|
| 4 |
散熱設計 |
2025-12 ~ 2026-01 |
|
| 5 |
Power rd |
2025-12 ~ 2026-01 |
|
| 6 |
二級高級工程師 |
2025-09 ~ 2025-10 |
|
| 7 |
散熱工程師 |
2025-04 ~ 2025-05 |
|
| 8 |
研發測試工程師 |
2025-04 ~ 2025-05 |
|
| 9 |
機構工程師 |
2025-03 ~ 2025-04 |
|
| 10 |
SQA |
2025-01 ~ 2025-02 |
|
| 11 |
系統分析師 |
2025-02 ~ 2025-03 |
|
| 12 |
SW |
2024-09 ~ 2024-10 |
|
| 13 |
DL |
2024-09 ~ 2024-10 |
|
| 14 |
硬體工程師 |
2024-08 ~ 2024-09 |
|
| 15 |
產測 |
2023-12 ~ 2024-01 |
|
| 16 |
軟體工程師 |
2024-06 ~ 2024-07 |
|
| 17 |
Firmware engineer |
2023-03 ~ 2023-04 |
|
| 18 |
資深工程師 |
2023-03 ~ 2023-04 |
|
| 19 |
FAE |
2023-03 ~ 2023-04 |
|
| 20 |
SW |
2023-03 ~ 2023-04 |
|
| 21 |
Hardware |
2023-03 ~ 2023-04 |
|
| 22 |
商管 |
2023-03 ~ 2023-04 |
|
| 23 |
PM |
2024-04 ~ 2024-05 |
|
| 24 |
EE |
2024-01 ~ 2024-02 |
|
| 25 |
電子工程師 |
2023-11 ~ 2023-12 |
|
| 26 |
EE |
2023-03 ~ 2023-04 |
|
| 27 |
三級高工 |
2023-03 ~ 2023-04 |
|
| 28 |
硬體工程師 |
2023-03 ~ 2023-04 |
|
| 29 |
測試工程師 |
2023-03 ~ 2023-04 |
|
| 30 |
EE |
2023-03 ~ 2023-04 |
|
| 31 |
RD |
2023-03 ~ 2023-04 |
|
| 32 |
硬體工程師 |
2023-03 ~ 2023-04 |
|
| 33 |
硬體研發 |
2023-03 ~ 2023-04 |
|
| 34 |
PM |
2023-03 ~ 2023-04 |
|
| 35 |
PM |
2023-03 ~ 2023-04 |
|
| 36 |
韌體工程師 |
2023-03 ~ 2023-04 |
|
| 37 |
韌體 |
2023-03 ~ 2023-04 |
|
| 38 |
後段NPI製程工程師 |
2023-03 ~ 2023-04 |
|
| 39 |
韌體工程師 |
2023-03 ~ 2023-04 |
|
| 40 |
SIT |
2023-03 ~ 2023-04 |
|
| 41 |
PM |
2023-03 ~ 2023-04 |
|
| 42 |
測試工程師 |
2023-03 ~ 2023-04 |
|
| 43 |
測試 |
2023-07 ~ 2023-08 |
|
| 44 |
測試 |
2023-05 ~ 2023-06 |
|
| 45 |
工程師 |
2023-05 ~ 2023-06 |
|
| 46 |
NB-EE |
2023-04 ~ 2023-05 |
|
| 47 |
零件工程師 |
2023-03 ~ 2023-04 |
|
| 48 |
專案工程師 |
2023-06 ~ 2023-12 |
|
| 49 |
作業員 |
2023-04 ~ 2023-05 |
|
| 50 |
DQA Sr. Engineer |
2017-05 ~ 2017-06 |
|
| 51 |
軟體工程師 |
2018-02 ~ 2018-06 |
|
| 52 |
法務專員 |
2018-03 ~ 2018-05 |
|
| 53 |
工程師 |
2017-01 ~ 2017-11 |
|
| 54 |
機構工程師 |
2017-05 ~ 2017-08 |
|
| 55 |
系統整合測試工程師 |
2018-01 ~ 2018-10 |
|
| 56 |
半導體製程人員 |
2017-02 ~ 2017-07 |
|
| 57 |
經理 |
2019-02 ~ 2019-11 |
|
| 58 |
網路工程師 |
2018-06 ~ 2018-09 |
|
| 59 |
電源工程師 |
2018-03 ~ 2018-11 |
|
| 60 |
EE |
2017-01 ~ 2017-12 |
|
| 61 |
機構高專 |
2018-10 ~ 2018-11 |
|
| 62 |
SIT |
2017-03 ~ 2017-05 |
|
| 63 |
散熱設計工程師 |
2017-01 ~ 2017-02 |
|
| 64 |
SIT |
2017-03 ~ 2017-11 |
|
| 65 |
採購 |
2018-01 ~ 2018-09 |
|